Suzhou Electric Appliance Research Institute
期刊號: CN32-1800/TM| ISSN1007-3175

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基于ANSYS電氣設(shè)備接頭的電熱耦合場分析

來源:電工電氣發(fā)布時間:2017-10-19 13:19 瀏覽次數(shù):12
基于ANSYS電氣設(shè)備接頭的電熱耦合場分析
 
李想,張琦,王曉娟,周穎
(三峽大學(xué) 電氣與新能源學(xué)院,湖北 宜昌 443002)
 
    摘 要:因電氣設(shè)備電接觸不良而導(dǎo)致設(shè)備局部放熱,是導(dǎo)致電網(wǎng)事故的主要原因之一?;诨裟冯娊佑|理論,利用ANSYS 軟件建立更為直觀的球面導(dǎo)體接觸模型。該模型充分考慮了電氣設(shè)備連接處實(shí)際接觸散熱情況,利用有限元法對接頭進(jìn)行電熱耦合場分析。仿真結(jié)果表明了在同種材料和不同材料接觸時,最高溫度均發(fā)生在接觸斑點(diǎn)處;但當(dāng)不同材料接觸時,上下接頭的溫度場分布不一樣,接頭最終溫度受材料的電阻系數(shù)、導(dǎo)熱系數(shù)等因素影響,電阻系數(shù)越大,導(dǎo)熱系數(shù)越小,最終接頭的溫度越高,如果電流過大,一般這種材料先發(fā)生軟化或熔化。
    關(guān)鍵詞:電接觸;電熱耦合;穩(wěn)態(tài)熱分析;有限元分析
    中圖分類號:TM503+.5     文獻(xiàn)標(biāo)識碼:A     文章編號:1007-3175(2017)10-0034-04
 
Analysis of Electro-Thermal Coupling Field of Electrical Equipment Contact Based on ANSYS
 
LI Xiang, ZHANG Qi, WANG Xiao-juan, ZHOU Ying
(College of Electrical Engineering & New Energy, China Three Gorges University, Yichang 443002, China)
 
    Abstract: That the bad contact of electrical equipment leads to the equipment local heating is the main cause of power network accidents. Based on Holm's contact theory, the software ANSYS was used to build a more intuitive spherical conductor contact model. This model sufficiently considered the actual contact heat dissipation of the electrical equipment junction and used the finite element method to analyze the electro-thermal coupling. The simulation result shows that the highest temperature occurs at the contact spot whether the contact surfaces have the same materials or not. However, when the different materials contact, the upper and lower joints of the temperature field distribution are different, and the final temperature of the contact will be affected by resistance coefficient and heat conductivity coefficient etc. The bigger the resistance coefficient, the smaller the heat conductivity coefficient and the higher the final contact temperature. If overcurrent occurs, the material will soften or melt firstly.
    Key words: electrical contact; electro-thermal coupling; steady state thermal analysis; finite element analysis
 
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